Aug 26, 2019 The Ultimate Weapon in Fire Protection of Residential. Goebel Raiko Carl, "Software Development Tool User Guide",.
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Risks, both short-term and long-term, to the physical, social, and economic. Globalization, Mass Media, and Global Awareness Levels in Emerging.
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Download 394; File Size 3.93 MB; File Count 1; Create Date July 9, 2015.
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. .A multilayered printed circuit board is used in various electronic equipment. The multilayered printed circuit board is formed by alternately laminating conductor circuits and insulating layers. The conductor circuits include, for example, a copper foil circuit for electrically connecting the circuits, a non-conductive resin circuit for preventing electromagnetic interference, a through hole conductor circuit for electrically connecting the copper foil circuit and the non-conductive resin circuit, and the like.
The conventional multilayered printed circuit board, however, has a problem that the conductive copper foil circuit and the non-conductive resin circuit are separated by a thick layer of the insulating resin as a base, causing a difference in the thermal expansion coefficient. As a result, there is a problem that micro cracks are generated in the interface between the copper foil circuit and the non-conductive resin circuit at the time of a heating process or the like during manufacturing, and the peel strength decreases.
Further, as a result of applying a photo-curing epoxy resin composition which is applied on the whole surface of the copper foil circuit and the non-conductive resin circuit, a thick layer of the epoxy resin remains at the portion corresponding to the interface between the conductor circuits, causing a problem that a desired peel strength cannot be obtained between the conductor circuit and the insulating resin.
The following method is known be359ba680
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